Three-Dimensional Molded Interconnect Devices (3D-MID)

Preface

Contents

1 MID Technology and Mechatronic Integration Potential

1.1

14

1.1.1

14

1.1.2

15

1.1.3

16

1.1.4

18

1.1.5

19

1.1.6

20

1.2

21

1.2.1

22

1.2.2

24

1.3

25

1.3.1

26

1.3.2 MID Focuses by Region

1.4 Main Fields of MID Research

1.5 Key Factors for Successful Projects

1.6

33

2 Materials for 3D-MID

2.1

38

2.2 Materials Properties and Determination of Characteristic Values for MID

2.2.1

42

2.2.2

46

2.2.2.1

46

2.2.2.2

48

2.2.2.3

48

2.2.3

50

2.3

52

2.3.1

52

2.3.1.1 Standard Thermoplastics

2.3.1.2

54

2.3.1.3 High-Performance Thermoplastics

2.3.2 Modified Thermoplastics for MID

2.3.2.1 Radiation Crosslinked Thermoplastics

2.3.2.2 Highly Filled Thermoplastics

2.3.2.3 Thermoplastics for Selected Technologies of MID Metallization

2.3.3 Thermoset Plastics for MID

3 Structuring and Metallization

3.1

76

3.1.1

77

3.1.1.1

77

3.1.1.1.1 LPKF-LDS® Process

3.1.1.1.2 ADDIMID Technology

3.1.1.1.3 Alternative Laser Structuring Processes

3.1.1.2 Printing Techniques

3.1.1.2.1

87

3.1.1.2.2 Inkjet Printing

3.1.1.2.3 Hot Embossing

3.1.2 Two-Shot Molding

3.1.3 Insert Molding

3.1.3.1 Film Insert Molding

3.1.3.1.1 Thermoplastic Foam Molding

3.1.3.1.2 Injection Compression Molding

3.1.3.1.3 Press Insert Molding

3.1.3.1.4

101

3.1.4 Alternative Structuring Processes

3.1.4.1 Primer Technology

3.1.4.2 Tampon Printing

3.1.4.3 Plasma Technologies

3.1.4.3.1 Flamecon®

3.1.4.3.2

105

3.2 Metallization

3.2.1 Cleaning the Substrate Surface

3.2.2 Metallization

3.2.3 Thickness and Roughness of Coatings

3.2.4 Current-Carrying Capability

4 Assembly Technology for 3D-MID

4.1 Process Chain

4.2 Assembly-Related Challenges

4.2.1 Effect of Structure

4.2.2 Component Placement on Three-Dimensional Bodies

4.3 Automated Assembly

4.3.1 Requirements

4.3.2 Application of Connection Medium

4.3.3 Placement of Components

4.3.4 Reflow Soldering

4.3.5 Optical Inspection

5 Interconnection Technology

5.1 Specifics and Challenges

5.2 Connection Mediums

5.2.1 Solder Paste

5.2.2 Conductive and Nonconductive Adhesives

5.2.2.1 Isotropic Conductive Adhesives

5.2.2.2 Anisotropic Conductive Adhesives

5.2.2.3 Nonconductive Adhesives

5.2.3 Press-In Pins

5.3 Connection Process

5.3.1 Reflow Soldering Techniques

5.3.1.1 Infrared Soldering

5.3.1.2 Convection Soldering

5.3.1.3 Vapor-Phase Soldering

5.3.2 Selective Soldering Processes

5.3.3 Gluing

5.3.4 Press-In Connection Technique

5.3.5 Chip Placement

5.3.5.1 Wire Bonding

5.3.5.2 Flip-Chip Technology

5.3.5.3 Glob Top

5.4 Interfacing to Periphery

5.5 Protecting Connections Against Environmental Influences

6 Quality and Reliability

6.1 Challenges of Quality Assurance

6.2 Simulation-Assisted Quality Validation

6.3 Nondestructive Testing Methods

6.3.1 Optical Testing and Inspection Methods

6.3.2 Automated Optical Inspection

6.3.3 X-ray Analysis

6.3.4 Computerized Tomography

6.3.5 X-ray Fluorescence Analysis

6.4 Destructive Testing Methods

6.4.1 Adhesive Strength

6.4.1.1 Peel Test

6.4.1.2 Pull-Off Test

6.4.1.3 Shear Pull Test

6.4.1.4 Chisel Test

6.4.1.5 Cross-Cut Test (Tape Test)

6.4.2 Measurement of Shear Force and Pull Test

6.4.3 Analysis of Prepared Sections

6.5 Electrical Characterization

6.5.1 Resistance

6.5.2 Ohmic Heating

6.5.3 Insulating Properties

6.6 Reliability Analysis

6.6.1 MID-Specific Challenges

6.6.2 Accelerated Aging

6.6.3 Application Example I: High-Temperature MID

6.6.4 Application Example II: Press-In Connections

7 MID Prototyping

7.1 Classification of Samples and Prototypes

7.1.1 Visualization Samples

7.1.2 Concept Model

7.1.3 Fully Functional Sample

7.1.4 Prototype

7.2 Processes for Producing Plastic Blanks

7.2.1 Stereolithography

7.2.2 Selective Laser Sintering

7.2.3 Fused Deposition Modeling

7.2.4 Vacuum Casting in Silicone Molds

7.2.5 Milling Thermoplastic Semifinished Products

7.2.6 Injection Molding

7.3 Samples and Prototypes Produced by the LPKF-LDS® Process

7.3.1 ProtoPaint LDS Process

7.3.2 LDS Process with FDM Plastic Parts

7.3.3 LDS Process with Vacuum Castings

7.3.4 LDS Process with Milled Semifinished Products

7.3.5 LDS Process with Moldings from Rapid Tooling Injection-Molding Tools

7.3.6 LDS Process with Moldings from Steel Tools with Nonhardened Inserts

7.4 Samples and Prototypes Produced by Hot Embossing

7.5 Samples and Prototypes Produced by Two-Shot Molding

7.6 Aerosol-Jet Printing on SLA Parts

7.7 Overview of the Various Combinations for MID Prototyping

8 Integrative Development of MID

8.1 Systematic Approach for the Development of MID

8.1.1 VDI Guideline 2206: Design Methodology for Mechatronic Systems

8.1.2 Thomas Peitz’ Methodology for Product Optimization of Mechanical Electronic Modules

8.1.3 Ingo Kaiser’s Systematic Approach for the Development of Mechatronic Systems

8.2 Requirements

8.3 Product Conceptualization

8.4 Production-Process Conceptualization

8.5 Electronics Design

8.6 Elaboration of the Production Process

8.7 Elaboration of Assembly and Connection Technology

8.8 Work Planning

8.9 MID-Specific Instruments of Development

8.9.1 MID Design Catalogs

8.9.2 Properties Cards for MID Processes

8.9.3 MID Guidelines

8.9.4 MID Features

8.10 Computer Assistance

8.10.1 MID-Specific Requirements for Development Tools

8.10.2 Software Tools for Design and Layout

8.10.3 Software Tools for Simulation

8.10.4 CAD/CAM Chains

9 Case Studies

9.1 OLED

9.2 Flow Sensor

9.3 Multiband Antenna for Smartphones

9.4 ACC Position Sensor

9.5 Pressure Sensor

9.6 MULTI LED

9.7 Insulin Pump

9.8 Passive UHF RFID Transponder

9.9 LED Camera Module

9.10 3D Switching Module

9.11 Security Caps

9.12 Solar Sensor

9.13 Microphone Carrier for Hearing Aid

9.14 Seat-Adjustment Switch

9.15 LED Light

10 List of Abbreviations

11 Literature

12 Authors and Contributors

12.1 Editor

12.2 Authors

12.3 Consulting Experts

13 Addresses

13.1 Research Association Molded Interconnect Devices (3-D.MID)

13.2 Members of the Research Association Molded Interconnect Devices (3-D.MID)

Index